Removing the perforated metal from the chips required a bit more effort than removing the trim metal, but it didn't take long.  The bond here was a bit stronger, and I had to use a plastic blade to get underneath the metal in order to get one end free.  From there it was a matter of rolling the strip of metal away until each side was left as pictured below.

One thing you may now note is that these are single sided memory modules.  Despite the back side having no chips to cool, a heatspreader was applied anyway.  Simply a strip of tape adhered to the PCB to hold the heatspreader in place.  While many may argue that a heatspreader does little on the memory chips, you honestly can't expect this arrangement to be too effective.  But, applying a heatspreader to both sides of a memory module is noting unique to OCZ Technology, as many companies do it.  It is only recently that I have noticed that this practice has been dropped by brands such as Super Talent, who does offer memory with a heatspreader only on the "chip side" of a single sided module.

The images below show the modules cleaned up with rubbing alcohol, and any traces of a heatspreader removed.  The chips are now free to breathe the air around them and take care of cooling all on their own.

What is left is a mangled pile of very thin, golden metal strips.